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ODM & OEM Service

– RFID Strap & Inlay & Tag Assembly
 • HF
 • UHF

– RFID Antenna Design and Manufacture
 • PET Substrate
  – Cu etching
  – Al etching
 • FR4 Substrate

RFID System Integration
– End-Point Communicator
RFID Business Scope
RFID Technology Definition
Au Bump
E’less Ni/Au Bump
MPK P-CSP™ Bump
Strap
Inlay
Label/Tag
Technology Introduction –P-CSP™
RFID Wafer
Cu Pad
Layer #1 Cu Bump
Encapsulation
Grinding
Layer #2 Cu Bump
Layer #2 Ni/Au Plating
Backside Grinding
Die Separation
Tape & Reel
Functional Test
P-CSP™
Inlay Assembly (Roll to Roll SMD System Overview)
Printer
Chip Mounter
Oven
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