產品應用

LGA Smart Card/超薄型SIM卡

The advanced technique reduces the thickness of flexible thin SIM form factor to 200 um only. The ultra-slim feature allows the thin SIM to be combined with existing SIM card to support multi-function such as encryption, telecommunication, and brings more business opportunity for the traditional SIM card.

先進技術使超薄型SIM卡可達業界最薄僅 200 um 封裝厚度,軟板特性與超薄封裝使其能與現有SIM卡結合,常應用於加密或通訊領域,並為現有傳統SIM卡增添附加價值。

➤LGA
➤SIM

LGA Smart Card/超薄型SIM卡