產品應用

Wafer Level CSP/RDL 晶圓級封裝/線路重佈

相豐 mutualpak RFID RDL & CSP

​Chip size : 9.75mm x 8.75mm
線寬 0.05mm 線距 0.025mm
Ball size : 0.4mm

相豐 mutualpak RFID RDL & CSP

Chip size : 0.8mm x 0.7mm
線寬 0.05mm 線距 0.025mm
Ball size : 0.15mm

MPK provides wafer level package solution, including WL-CSP, RDL, SESUP, and Multi-chip package with reasonable cost and reliable performance that meets customer’s needs in various application.

MPK 提供的WL-CSP晶圓級封裝解決方案,包含CSP、RDL、SESUP、Multi-chip 封裝等,能以合乎效益的成本與可靠的效能滿足客戶在不同應用領域的需求。

➤Wafer Level Package
➤CSP
➤RDL
➤Bumping

Wafer Level CSP/RDL 晶圓級封裝/線路重佈