产品应用

MPK provides wafer level package solution, including WL-CSP, RDL, FOiP/SESUP, and Multi-chip package with reasonable cost and reliable performance that meets customer’s needs in various application.

MPK 提供的WL-CSP晶圆级封装解决方案，包含CSP、RDL、FOiP/SESUP、Multi-chip 封装等，能以合乎效益的成本与可靠的效能满足客户在不同应用领域的需求。