Products & Applications
Products & Applications
Wafer Level CSP/RDL
![相豐 mutualpak RFID RDL & CSP 相豐 mutualpak RFID RDL & CSP](https://www.mutualpak.com/web/wp-content/uploads/2021/12/WLP01-3.jpg)
Chip size : 9.75mm x 8.75mm
Width : 0.05mm Spacing : 0.025mm
Ball size : 0.4mm
![相豐 mutualpak RFID RDL & CSP 相豐 mutualpak RFID RDL & CSP](https://www.mutualpak.com/web/wp-content/uploads/2021/12/WLCSP-02-2.jpg)
Chip size : 0.8mm x 0.7mm
Width : 0.05mm Spacing : 0.025mm
Ball size : 0.15mm
MPK provides wafer level package solution, including WL-CSP, RDL, FOiP/SESUP, and Multi-chip package with reasonable cost and reliable performance that meets customer’s needs in various application.